Bleifreie Lötkugeln 0,30mm 25.000 Stück für Elektronik-Lötarbeiten
Marke: Pmtc
Inkl. MwSt. (Exkl. MwSt.: 6,00€)
Das bleifreie Lötkugeln 0,30mm 25.000 Stk. ist ein unverzichtbares Produkt für Elektronikprofis, die hochwertige Materialien für Löt- und Reballing-Prozesse benötigen. Diese bleifreien Lötkugeln sind für eine optimale Leistung bei der Reparatur und Herstellung elektronischer Schaltungen ausgelegt.
Hauptmerkmale:
- Durchmesser: 0,30 mm, ideal für präzise und detailgenaue Arbeiten.
- Menge: 25.000 Stück pro Dose, ausreichend für mehrere Anwendungen.
- Zusammensetzung: 96.5% Zinn (Sn), 3.0% Silber (Ag), 0.5% Kupfer (Cu), für hochwertiges bleifreies Löten.
- Hersteller: Profound Material Technology, Taiwan, bekannt für Qualität bei Lötmaterialien.
- Bleifrei: Entspricht Umwelt- und Gesundheitsvorschriften durch den Verzicht auf Blei beim Löten.
Typische Anwendungen:
- Reballing von BGA und anderen elektronischen Bauteilen.
- Präzisionslöten auf Leiterplatten (PCB).
- Reparatur und Wartung elektronischer Geräte.
Kompatibilität: Kompatibel mit Lötstationen und Reballing-Werkzeugen, die Lötkugeln mit 0,30 mm unterstützen. Ideal für Profis, die zuverlässige und effiziente Materialien für ihre Prozesse suchen.
Diese Dose mit bleifreien Lötkugeln ist eine ausgezeichnete Wahl für alle, die Qualität, Zuverlässigkeit und die Einhaltung von Umweltstandards beim Elektroniklöten suchen. Obwohl derzeit ausverkauft, lohnt es sich, für zukünftige Verfügbarkeiten aufmerksam zu bleiben.
- Bleifreie Lötkugeln mit 0,30 mm Durchmesser
- 25.000 Stück pro Dose
- Zusammensetzung 96.5Sn-3.0Ag-0.5Cu für hochwertiges Löten
- Hergestellt von Profound Material Technology in Taiwan
- Ideal für Reballing und professionelle Elektronik-Lötarbeiten
Kundenfragen & Antworten
What applications is the 0.30 mm lead-free solder ball suitable for?
The 0.30 mm lead-free solder balls are mainly designed for reballing processes on high-density BGA components, such as those found in mobile phones, laptops and miniaturised electronic devices. Their size is ideal for work requiring precision and fine joints.
What is the composition and what advantages does the 96.5Sn-3.0Ag-0.5Cu alloy offer?
This alloy (96.5% tin, 3% silver, 0.5% copper) is standard in RoHS lead-free soldering and provides good wetting, superior mechanical strength and a lower likelihood of tin whisker formation compared with Sn-Cu-only alloys. It offers a melting point of around 217–219°C.
Are there any specific temperature requirements and compatibility considerations with BGA rework stations?
Yes, for this lead-free alloy, a thermal profile reaching between 235°C and 245°C should be used during the reflow phase. It is compatible with most BGA rework stations, provided they support these thermal ranges. It is not recommended for use with equipment not prepared for lead-free soldering.
What are the main differences compared with conventional leaded solder balls?
The main difference is the absence of lead, meeting RoHS regulations and making it more environmentally safe. However, lead-free alloy generally requires a higher soldering temperature (around 20°C higher) and shows slight differences in wetting and joint longevity.
Does the 25,000-unit jar require any special storage conditions or have an expiry date?
It is recommended to keep the balls in their original jar, in a dry place with <35% RH and at room temperature (<25°C), to prevent oxidation. If stored correctly, the shelf life is usually 1-2 years, although after that period the risk of oxidation or contamination increases.
What applications is the 0.30 mm lead-free solder ball suitable for?
The 0.30 mm lead-free solder balls are mainly designed for reballing processes on high-density BGA components, such as in mobile phones, laptops and miniaturised electronic devices. Their size is ideal for work requiring precision and fine joints.
What is the composition and what advantages does the 96.5Sn-3.0Ag-0.5Cu alloy offer?
This alloy (96.5% tin, 3% silver, 0.5% copper) is standard in RoHS lead-free soldering and provides good wetting, superior mechanical strength and a lower likelihood of tin whisker formation compared with Sn-Cu-only alloys. It has a melting point of around 217–219°C.
Are there any specific temperature requirements and compatibility considerations with BGA rework stations?
Yes, for this lead-free alloy, a thermal profile reaching between 235°C and 245°C should be used during the reflow phase. It is compatible with most BGA rework stations, provided they support these thermal ranges. It is not recommended for use with equipment not prepared for lead-free soldering.
What are the main differences compared with conventional leaded solder balls?
The main difference is the absence of lead, meeting RoHS regulations, which makes it safer for the environment. However, lead-free alloy generally requires a higher soldering temperature (around 20°C higher) and shows slight differences in wetting and joint longevity.
Does the 25,000-unit jar have any special storage conditions or shelf life?
It is recommended to keep the balls in their original jar, in a dry place with <35% RH and room temperature (<25°C), to avoid oxidation. If stored correctly, shelf life is usually 1-2 years, although after that period the risk of oxidation or contamination increases.
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